Nanoparticles for improving the dimensional stability of resins

A composition may include the resin and a plurality of polymer nanoparticles included in the resin to form a resin mixture. The resin may have a resin coefficient of thermal expansion (CTE), a resin cure shrinkage, and/or a resin heat of reaction. The polymer nanoparticles may have a nanoparticle cu...

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Bibliographische Detailangaben
Hauptverfasser:	Meure, Samuel J, Kozar, Michael P, Wilenski, Mark S
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	A composition may include the resin and a plurality of polymer nanoparticles included in the resin to form a resin mixture. The resin may have a resin coefficient of thermal expansion (CTE), a resin cure shrinkage, and/or a resin heat of reaction. The polymer nanoparticles may have a nanoparticle cure shrinkage less than the resin cure shrinkage, a nanoparticle CTE different than the resin CTE, and/or a nanoparticle heat of reaction less than the resin heat of reaction.