Flexible elastic thermal bridge for electronic subassemblies with variable gaps between components and enclosures

An electronic subassembly includes an enclosure, a circuit board, a plurality of electronic components, and a plurality of flexible elastic thermal elements. Each flexible elastic thermal bridge is disposed in the gap between a different one of the electronic components and a first wall of the enclosure. Each flexible elastic thermal bridge includes a first thermally conductive metallic structure, a second thermally conductive metal structure, and an elastically deflectable thermal element. The first thermally conductive metallic structure contacts the first wall. The second thermally conductive metallic structure contacts the top surface of the electronic component and is spaced apart from the first thermally conductive metallic structure to define a void. The elastically deflectable thermal element is disposed in the void and directly contacts both the first thermally conductive metallic structure and the second thermally conductive metallic structure. The elastically deflectable thermal element comprises at least one thermally conductive material.