Microelectronic device utilizing stacked vertical devices

An embodiment may include a microelectronic device. The microelectronic device may include a first pair of transistors stacked vertically and connected in series. Each of the first pair of transistors are of the same type. The microelectronic device may include a second pair of transistors connected...

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Bibliographische Detailangaben
Hauptverfasser: Werner, Tobias, Wendel, Dieter, Sautter, Rolf, Pille, Juergen, Frisch, Albert
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An embodiment may include a microelectronic device. The microelectronic device may include a first pair of transistors stacked vertically and connected in series. Each of the first pair of transistors are of the same type. The microelectronic device may include a second pair of transistors connected in parallel. The second pair of transistors being a different type than the first pair of transistors. The first pair of transistors and the second pair of transistors are arranged substantially perpendicular to the plurality of layers.