Sonic sensors and packages

Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a se...

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Bibliographische Detailangaben
Hauptverfasser:	Elian, Klaus, Theuss, Horst
Format:	Patent
Sprache:	eng
Schlagworte:	ACOUSTICS ACOUSTICS NOT OTHERWISE PROVIDED FOR ANALOGOUS ARRANGEMENTS USING OTHER WAVES DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY MUSICAL INSTRUMENTS PERFORMING OPERATIONS PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION SOUND-PRODUCING DEVICES TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.