Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy

An aqueous indium or indium alloy plating bath comprising - a source of indium ions, - an acid, - a source of halide ions, - a surfactant according to formula (I) wherein A is selected from branched or unbranched C 10 -C 15 -alkyl; B is selected from the group consisting of hydrogen and alkyl; m is...

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Bibliographische Detailangaben
Hauptverfasser:	Pieper, Stefan, Sperling, Jan, Kirbs, Andreas, Rohde, Dirk, Vazhenin, Grigory, Castellani, Mauro
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An aqueous indium or indium alloy plating bath comprising - a source of indium ions, - an acid, - a source of halide ions, - a surfactant according to formula (I) wherein A is selected from branched or unbranched C 10 -C 15 -alkyl; B is selected from the group consisting of hydrogen and alkyl; m is an integer ranging from 5 to 25; each R is independently from each other selected from hydrogen and methyl; and - a dihydroxybenzene derivative of formula (II) wherein each X is independently selected from fluorine, chlorine, bromine, iodine, alkoxy, and nitro; n is an integer ranging from 1 to 4, and a process for deposition of indium or an indium alloy wherein said bath is used.