Package and method of manufacturing the same, and light emitting device using the package

A package includes a first lead electrode, a second lead electrode, and a resin molded body. The first lead electrode has a first upper surface and a first lower surface defining a depression and opposite to the first upper surface. The second lead electrode has a second upper surface and a second l...

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Bibliographische Detailangaben
1. Verfasser:	Miki, Tomohide
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A package includes a first lead electrode, a second lead electrode, and a resin molded body. The first lead electrode has a first upper surface and a first lower surface defining a depression and opposite to the first upper surface. The second lead electrode has a second upper surface and a second lower surface opposite to the second upper surface. The resin molded body defining a recess with a bottom surface including the first upper surface and the second upper surface, the resin molded body also covering the first lower surface and the second lower surface. The first electrode having a first region closer to the second lead electrode and a second region farther to the second lead electrode than the first region, and having a thickness smaller than a thickness of the first region due to the depression defined in the first lower surface.