Flexible panel and manufacturing method thereof
A manufacturing method of the flexible panel is provided. Firstly, a carrier substrate is provided. Then, an adhesion layer is formed on the carrier substrate, a flexible substrate is formed on the adhesion layer, and a buffer layer is formed on the flexible substrate. Then, a device layer is formed...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A manufacturing method of the flexible panel is provided. Firstly, a carrier substrate is provided. Then, an adhesion layer is formed on the carrier substrate, a flexible substrate is formed on the adhesion layer, and a buffer layer is formed on the flexible substrate. Then, a device layer is formed on the flexible substrate. Next, a separating process is performed for separating the flexible substrate and the device layer from the carrier substrate. According to a relation between a thermal expansion coefficient of the flexible substrate and a thermal expansion coefficient of the carrier substrate, the manufacturing method of the flexible panel selects a pattern of the adhesion layer. The pattern of the adhesion layer includes a frame adhesion structure or a plane adhesion structure. |
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