Debugging a semiconductor device

Devices and techniques are disclosed herein for debugging a device implemented on a die using non-test pins. An instruction to enable a debugging mode of operation is received with a memory device implemented at least in part on a die. In response to receiving the instruction, functionality of a first non-test pin of the die is modified to enable debugging data to be transmitted to a debugging component external to the die over the first non-test pin of the die. A debugging clock signal is established using a signal received at a second non-test pin of the die. Information including the debugging data is exchanged between the die and the debugging component using the first and second non-test pins of the die.