Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate

The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present inve...

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Bibliographische Detailangaben
Hauptverfasser:	Brunner, Heiko, Witczak, Agnieszka, Mann, Olivier, Kohlmann, Lars
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY COMPOSITIONS BASED THEREON ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.