Semiconductor device

A semiconductor device may include a stack in which a cooler and a semiconductor module are stacked, the semiconductor module housing a semiconductor element; a contact plate contacting the stack in a stacking direction of the semiconductor module and the cooler; and a spring contacting the contact...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Uchiyama, Kazunori, Hakamada, Naoki, Yoshida, Tadafumi, Deguchi, Masataka, Hotta, Koji, Sasaki, Tomo
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor device may include a stack in which a cooler and a semiconductor module are stacked, the semiconductor module housing a semiconductor element; a contact plate contacting the stack in a stacking direction of the semiconductor module and the cooler; and a spring contacting the contact plate and pressurizing the stack via the contact plate in the stacking direction, wherein the spring may contact a center portion of the contact plate in a direction perpendicular to the stacking direction, and a recess or a cavity may be provided at the center portion of the contact plate, the recess facing the stack.