System and method for minimizing backside workpiece damage

A system and method for minimizing the damage to the backside of a workpiece disposed on a platen during thermal transitions is disclosed. The system includes a controller that modulates the clamping voltage and backside gas pressure during the thermal transition. By modulating the clamping voltage, the workpiece may not be as tightly held to the platen at certain times, thus minimizing damage that may be caused by particles resident on the top surface of the platen. Furthermore, the modulation of the backside gas pressure still permits good thermal conductivity between the platen and the workpiece.