Leadframe assembly for a semiconductor device

The present disclosure relates to a lead frame assembly for a semiconductor device. The leadframe assembly includes a clip frame structure with a die connection portion configured and arranged for contacting to one or more contact terminals on a top side of a semiconductor die; and one or more electrical leads extending from the die connection portion at a first end. The die connection portion includes a hooking tab extending therefrom configured and arranged to engage with a wire loop of a wire pull test equipment. The disclosure also relates to an interconnected matrix of such leadframe.