Plasticity induced bonding

Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.

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Bibliographische Detailangaben
Hauptverfasser:	Slocum, Alexander H, Padhye, Nikhil, Parks, David Moore, Trout, Bernhardt Levy
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY CONTROL DEVICES OR SYSTEMS INSOFAR AS CHARACTERISED BYMECHANICAL FEATURES ONLY CONTROLLING DYES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS PHYSICS POLISHES REGULATING SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.