Solid state power switch with optimized heat sink configuration

A high current, solid state, electrical switch has switch terminal blocks on opposite sides of one or more arrays of parallel connected, solid state, high current, power switching devices mounted on a support. A first terminal of each switching device of each array is directly electrically and thermally bonded to a switch terminal block. A bus bar thermal bridge is directly electrically and thermally bonded to a second terminal of the switching device of each array. A thermally conductive heat sink panel is contoured in alignment with, and has a surface in spaced juxtaposition from, a surface of the bus bar thermal bridge and from surfaces of each of the switch terminal blocks. A thermally conductive, electrically insulating thermal interface material thermally contacts and extends between all said surfaces for conducting heat from the switch terminal blocks and from the thermal bridge to the heat sink panel.