Computing devices with an adhered cover and methods of manufacturing thereof

A computing device is described. The computing device includes a support structure with an interface surface that has a cross-sectional width. The computing device includes a cover adhered to the interface surface of the support structure along an entirety of the cross-sectional width of the interfa...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Tripard, Jason Edward, Shah, Ketan R, Evans, Ryan Travis, Schultz, III, Bernard Maurice
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A computing device is described. The computing device includes a support structure with an interface surface that has a cross-sectional width. The computing device includes a cover adhered to the interface surface of the support structure along an entirety of the cross-sectional width of the interface surface. A method of manufacturing a computing device is described. The method includes applying an adhesive to a cover. A support structure of a computing device is heated. The support structure is cooled. While the support structure is heated and cooled, pressure is applied to the cover.