Block copolymer composition and adhesive composition

A main object of the present disclosure is to provide a block copolymer composition that allows an adhesive composition having excellent die-cutting properties, softening agent anti-migration performance, mandrel properties and transparency to be obtained. The object is achieved by providing a block...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Hashimoto, Sadaharu, Furuko, Ayako
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A main object of the present disclosure is to provide a block copolymer composition that allows an adhesive composition having excellent die-cutting properties, softening agent anti-migration performance, mandrel properties and transparency to be obtained. The object is achieved by providing a block copolymer composition comprising: a block copolymer A represented by the following formula (I); and a block copolymer B represented by the following formula (II); characterized in that: a content of an aromatic vinyl monomer unit of the block copolymer A is more than a content of an aromatic vinyl monomer unit of the block copolymer B; a weight average molecular weight of aromatic vinyl polymer block Ar3 (Mw(Ar3)) of the block copolymer B is substantially the same as a weight average molecular weight of aromatic vinyl polymer block Ar1 (Mw(Ar1)) of the block copolymer A; and breaking strength of the block copolymer composition is 8 MPa or less and breaking elongation of the block copolymer composition is 2000% or less.