Fire suppression system modules and methods of sealing

Fire suppression systems (10) include modules (14x) interconnected with a centralized controller (12). The modules (14x) are configured, assembled and sealed for system operation in harsh environments. Modules of the system include a printed circuit board (PCB, 32, 132), a microprocessor (34), and a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Fernstrum, Marvin B, Counts, Brian Lee, Ryczek, Chad Lee
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Fire suppression systems (10) include modules (14x) interconnected with a centralized controller (12). The modules (14x) are configured, assembled and sealed for system operation in harsh environments. Modules of the system include a printed circuit board (PCB, 32, 132), a microprocessor (34), and an operative component (36) assembled within a housing (30, 130). A gasket member (38) is disposed about the component to form a seal about the component. Operative components may include fire detection elements (14x, 50) or an LCD screen (36, 236). Modules of the system can include an encapsulant compound for filling a void between the housing inner surface and the printed circuit board. Modules of the system can include a sealed chamber with a port to interface a computer device. A power module of the system includes a sealed housing with connectors positioned to protect against moisture and debris and an isolating switch to permit maintenance of the system.