Method for manufacturing an electronic assembly

A method for manufacturing an electronic assembly features a semiconductor device with a first side and a second side opposite the first side to facilitate enhanced thermal dissipation. The first side has a first conductive pad. The second side has a primary metallic surface. By heating the assembly...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Palmer, Brad G, Singh, Brij N, Kinyanjui, Robert K, Zurn, Michael J, Roan, Thomas J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for manufacturing an electronic assembly features a semiconductor device with a first side and a second side opposite the first side to facilitate enhanced thermal dissipation. The first side has a first conductive pad. The second side has a primary metallic surface. By heating the assembly once, a first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer; and second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.