Optoelectronic semiconductor component
A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoele...
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creator | Wirth, Ralph Kaltenbacher, Axel Marfeld, Jan Weidner, Karl Wegleiter, Walter Wutz, Oliver Barchmann, Bernd |
description | A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body. |
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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200526&DB=EPODOC&CC=US&NR=10665747B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200526&DB=EPODOC&CC=US&NR=10665747B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Wirth, Ralph</creatorcontrib><creatorcontrib>Kaltenbacher, Axel</creatorcontrib><creatorcontrib>Marfeld, Jan</creatorcontrib><creatorcontrib>Weidner, Karl</creatorcontrib><creatorcontrib>Wegleiter, Walter</creatorcontrib><creatorcontrib>Wutz, Oliver</creatorcontrib><creatorcontrib>Barchmann, Bernd</creatorcontrib><title>Optoelectronic semiconductor component</title><description>A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDzLyjJT81JTS4pys_LTFYoTs3NTM7PSylNLskvUkjOzy3Iz0vNK-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGZmam5ibmTkbGxKgBANQfKKU</recordid><startdate>20200526</startdate><enddate>20200526</enddate><creator>Wirth, Ralph</creator><creator>Kaltenbacher, Axel</creator><creator>Marfeld, Jan</creator><creator>Weidner, Karl</creator><creator>Wegleiter, Walter</creator><creator>Wutz, Oliver</creator><creator>Barchmann, Bernd</creator><scope>EVB</scope></search><sort><creationdate>20200526</creationdate><title>Optoelectronic semiconductor component</title><author>Wirth, Ralph ; 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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Optoelectronic semiconductor component |
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