Optoelectronic semiconductor component

A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoele...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Wirth, Ralph, Kaltenbacher, Axel, Marfeld, Jan, Weidner, Karl, Wegleiter, Walter, Wutz, Oliver, Barchmann, Bernd
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.