Integrated circuit substrate and method of making

According to various embodiments of the present disclosure, a substrate for an integrated circuit includes a dielectric layer. The substrate further includes a conductive layer extending in an x or y direction. The conductive layer is at least partially embedded within the dielectric layer. The cond...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Pietambaram, Srinivas, Wall, Marcel Arlan, Ganesan, Kousik, Manepalli, Rahul N
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	According to various embodiments of the present disclosure, a substrate for an integrated circuit includes a dielectric layer. The substrate further includes a conductive layer extending in an x or y direction. The conductive layer is at least partially embedded within the dielectric layer. The conductive layer includes a via having a first end and an opposite second end. The via has a first height in a z-direction and a constant cross-sectional shape between the first end and the second end. A trace is adjacent to the via and has a second height in the z-direction that is different than the first height.