Photosensitive resin composition and cured film prepared therefrom

Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. By comprising a copolymer (A) and a photopolymerizable compound (B) in specific amounts, a photosensitive resin composition may form a cured film having pattern developability with high resolution and good e...

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Bibliographische Detailangaben
Hauptverfasser:	Jeon, Hyung-Tak, Choi, Gyung-Sik, Park, Seok-Bong
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CINEMATOGRAPHY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS CORRECTING FLUIDS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DYES ELECTRICITY ELECTROGRAPHY FILLING PASTES FREQUENCY-CHANGING HOLOGRAPHY INKS INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. By comprising a copolymer (A) and a photopolymerizable compound (B) in specific amounts, a photosensitive resin composition may form a cured film having pattern developability with high resolution and good elasticity recovery rate. The composition may be effectively used for the formation of a cured film, particularly a spacer of a display device such as a liquid crystal display and an organic electroluminescence device.