Electronic assembly

Electronic assembly

An electronic assembly includes a substrate film for accommodating electronics, an electrical contact pad coupled to the substrate film, an electrically conductive member coupled to the electrical contact pad, and a material layer molded onto the substrate film to embed the elastic electrically cond...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Heikkinen, Mikko, Sääski, Jarmo
Format: Patent
Sprache:eng
Schlagworte:
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:An electronic assembly includes a substrate film for accommodating electronics, an electrical contact pad coupled to the substrate film, an electrically conductive member coupled to the electrical contact pad, and a material layer molded onto the substrate film to embed the elastic electrically conductive member.