Multi-part device and method for manufacturing this multi-part device

A device includes a joining partner, which protrudes at a submersion depth into a recess filled at least partially with a fixing element in a substrate surface of a substrate. A compensating element is situated between the joining partner and the fixing element. The compensating element is situated...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Schalowski, Gerhard, Kim, Hack-Min, Wagner, Walter, Rother, Christian, Kimpel, Thomas, Segiet, Raphael
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A device includes a joining partner, which protrudes at a submersion depth into a recess filled at least partially with a fixing element in a substrate surface of a substrate. A compensating element is situated between the joining partner and the fixing element. The compensating element is situated at least partially in the fixing element within the submersion depth of the joining partner. Accordingly, the compensating element is in contact with the joining partner and with the fixing element. In this way, an expansion change or a movement of the fixing element, of the substrate or of the joining partner may be compensated for by a compression or elongation of the compensating element. A crack formation may be avoided or its effect may be minimized by the sealing function.