Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board

An adhesive film according to the present invention includes a resin composition layer (layer A) for an interlayer insulating layer, a thermosetting resin composition layer (layer B), and a support film (layer C), and the layer C, the layer A, and the layer B are sequentially arranged in this order....

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Bibliographische Detailangaben
Hauptverfasser:	Fukai, Hiroyuki, Ogawa, Nobuyuki, Fujita, Hiroaki, Matsuura, Masaharu
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An adhesive film according to the present invention includes a resin composition layer (layer A) for an interlayer insulating layer, a thermosetting resin composition layer (layer B), and a support film (layer C), and the layer C, the layer A, and the layer B are sequentially arranged in this order. The layer A is a resin composition which contains a thermosetting resin (a1) and an inorganic filler (b1) having a specific surface area of 20 m2/g or more, and the mass ratio of the thermosetting resin (a1) to the inorganic filler (b1) is within the range from 30:1 to 2:1. The layer B contains a thermosetting resin composition which is in a solid state at a temperature lower than 40° C. but melts at a temperature of 40° C. or higher but lower than 140° C. Consequently, the adhesive film according to the present invention can solve problems in a laser process and a desmear removal process following the laser process and can form a conductor layer which has a high adhesion strength even on an interlayer insulating layer having a smooth surface-roughened state.