Thermoelectric cooler (TEC) having top and bottom plates with asymmetric thermal conductivity and an optical subassembly implementing the same

In general, the present disclosure is directed to a thermoelectric cooler (TEC) that includes a top plate or bottom plate being formed of a high thermal conductivity material, and the other of the top plate and bottom plate being formed of a low thermal conductivity material, with the high thermal c...

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Bibliographische Detailangaben
Hauptverfasser:	Li, Qin, Wang, Chong, Ho, I-Lung
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING COMBINED HEATING AND REFRIGERATION SYSTEMS DEVICES USING STIMULATED EMISSION ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING MULTIPLEX COMMUNICATION REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING TRANSMISSION WEAPONS
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Beschreibung
Zusammenfassung:	In general, the present disclosure is directed to a thermoelectric cooler (TEC) that includes a top plate or bottom plate being formed of a high thermal conductivity material, and the other of the top plate and bottom plate being formed of a low thermal conductivity material, with the high thermal conductivity material having a thermal conductivity at least twice, and preferably five times, that of the thermal conductivity of the low thermal conductivity material. This disparity in thermal conductivity between the top plate and bottom plate materials may be referred to herein as asymmetric thermal performance.