Field device with a component for filling potting compound

The invention relates to a field device of automation technology with an opened housing and an electronics part in the housing, comprising at least one component for filling potting compound into the housing, wherein the component has a trough, in order to conduct the potting compound, with targetin...

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Bibliographische Detailangaben
Hauptverfasser:	Seiler, Christian, Huwyler, Willy, Moser, Silvio
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TARIFF METERING APPARATUS TESTING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The invention relates to a field device of automation technology with an opened housing and an electronics part in the housing, comprising at least one component for filling potting compound into the housing, wherein the component has a trough, in order to conduct the potting compound, with targeting, to a location of the housing to be potted.