Electrical connection tape

A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt %...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Arora, Sanyogita, Tormey, Ellen S, Singh, Bawa, Prokopiak, Steven Dane, Pandher, Ranjit S
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.