Imaging module with multi-layer substrate and endoscope apparatus

An imaging module includes: an image sensor; a substrate having a conductor layer and extending from the image sensor; a multi-layer substrate having therein conductor layers on the substrate; electronic components mounted on/in the multi-layer substrate; an image signal electrode pad and a drive signal electrode pad on the image sensor; an image signal cable; a drive signal cable; an image signal wiring pattern through which an image signal is transmitted from the image signal electrode pad to the image signal cable; and a drive signal wiring pattern through which a drive signal is transmitted from the drive signal cable to the drive signal electrode pad. At least one of the electronic components is embedded inside the multi-layer substrate. The image signal wiring pattern and the drive signal wiring pattern are separated into different conductor layers of the substrate and the multi-layer substrate due to the embedded electronic component.