Methods of manufacturing flexible printed circuit boards

A method of manufacturing a flexible electronic device is described. The method comprises arranging an electronic component on a temporary carrier, providing a flexible laminate comprising an adhesive layer, pressing the temporary carrier and the flexible laminate together with the adhesive layer fa...

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Bibliographische Detailangaben
Hauptverfasser:	Zluc, Andreas, Stahr, Johannes
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method of manufacturing a flexible electronic device is described. The method comprises arranging an electronic component on a temporary carrier, providing a flexible laminate comprising an adhesive layer, pressing the temporary carrier and the flexible laminate together with the adhesive layer facing the temporary carrier such that the electronic component is pushed into the adhesive layer, and removing the temporary carrier. Further, a corresponding flexible electronic device is described.