Antireflection structure for integrated laser diode/photonic chip interface

A method of manufacturing a LIDAR chip and applying an anti-reflection (AR) coating to a coupling structure of the LIDAR chip. The coupling structure if formed on a wafer. A pocket is formed in the wafer adjacent the coupling structure. The AR material is deposited on top of the wafer and coupling s...

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Bibliographische Detailangaben
Hauptverfasser:	Sayyah, Keyvan, Huang, Biqin, Patterson, Pamela R
Format:	Patent
Sprache:	eng
Schlagworte:	ANALOGOUS ARRANGEMENTS USING OTHER WAVES BASIC ELECTRIC ELEMENTS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES DEVICES USING STIMULATED EMISSION ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION TESTING
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Beschreibung
Zusammenfassung:	A method of manufacturing a LIDAR chip and applying an anti-reflection (AR) coating to a coupling structure of the LIDAR chip. The coupling structure if formed on a wafer. A pocket is formed in the wafer adjacent the coupling structure. The AR material is deposited on top of the wafer and coupling structure. The AR material is etched to form the AR coating on the coupling structure.