Corrosion resistant aluminum bond pad structure

A method of manufacturing a bond pad structure may include depositing an aluminum-copper (Al-Cu) layer over a dielectric layer; and depositing an aluminum-chromium (Al-Cr) layer directly over the Al-Cu layer.

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Bibliographische Detailangaben
Hauptverfasser:	Arvin, Charles L, Gambino, Jeffrey P, Musante, Charles F, Muzzy, Christopher D, Sauter, Wolfgang
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS METALLURGY SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	A method of manufacturing a bond pad structure may include depositing an aluminum-copper (Al-Cu) layer over a dielectric layer; and depositing an aluminum-chromium (Al-Cr) layer directly over the Al-Cu layer.