Exposed die sensor package

Packaging techniques are described for fabricating an sensor package that include one or more sensor devices, such as optical sensors or light sources, where an active side of the sensor device is exposed. Additionally, the side of the sensor package including the sensor die is substantially flat (e.g., topology is less than about 75 μm), the sensor package does not include wire bonding, and the package interconnect (e.g., solder bump array or other connection) is disposed on a side of the sensor package opposite the sensor die.