Semiconductor package having junction cooling pipes embedded in substrates

Semiconductor package having junction cooling pipes embedded in substrates

Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Lee, Byoungok, Im, Seungwon, Lee, Yoonsoo, Son, Joonseo, Jeon, Oseob, Park, Changyoung, Lee, Dukyong
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.