Package base core and sensor package structure

The present disclosure provides a package base core and a sensor package structure. The package base core includes a substrate and at least one stopper, or the package base core includes a substrate, at least one stopper, and a compound. The sensor package structure includes a substrate, a first sto...

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Bibliographische Detailangaben
Hauptverfasser:	Hsin, Chung-Hsin, Lin, Chien-Heng, Hsieh, Kun-Chih, Peng, Chen-Pin
Format:	Patent
Sprache:	eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS SEMICONDUCTOR DEVICES TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	The present disclosure provides a package base core and a sensor package structure. The package base core includes a substrate and at least one stopper, or the package base core includes a substrate, at least one stopper, and a compound. The sensor package structure includes a substrate, a first stopper, a second stopper, a sensing member, a first compound, a second compound, and a translucent member. The stopper (or the first and second stoppers) of the present disclosure is provided to form with a protruding portion on the substrate, so that an overflowing of the compound can be avoided, thereby increasing the reliability of the package base core.