Dynamic determination of metal film thickness from sheet resistance and TCR value

Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the met...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Cui, Jianli, Johnson, Walter, Li, Huanglin, Liu, Xianghua, Liu, Liming, Cheng, Juli, Yu, Lu, Zhu, Nanchang
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ANGLES MEASURING AREAS MEASURING ELECTRIC VARIABLES MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MEASURING MAGNETIC VARIABLES PHYSICS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.