Method and apparatus for separating a thermal load path from a structural load path in a circuit board environment

A heat sink includes a plurality of apertures extending therethrough. The heat sink is arranged substantially parallel to a circuit board and includes at least one aperture transversely aligned with a corresponding IC chip of the circuit board. An underside of the heat sink is structurally connected to the circuit board. A plurality of thermal bridges is provided. Each thermal bridge includes a center bridge pad and at least one footer pad, connected via at least one offset wire. Each thermal bridge is aligned with a corresponding aperture. An underside of each footer pad is attached to the heat sink, with the offset wire extending into the corresponding aperture to suspend the center bridge pad at least partially into the aperture above the IC chip, thus creating a thermal load path. The apparatus separates a thermal load path from a structural load path in a circuit board environment.