Manufacturing method of glass substrate with hole

A manufacturing method of a glass substrate with a hole having a diameter ϕf, and with a thickness θf includes setting a thickness θ1 of a glass plate that is to be processed; preparing a glass plate with the thickness θ1, having first and second surfaces opposite to each other; forming one initial...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	Ono, Motoshi
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A manufacturing method of a glass substrate with a hole having a diameter ϕf, and with a thickness θf includes setting a thickness θ1 of a glass plate that is to be processed; preparing a glass plate with the thickness θ1, having first and second surfaces opposite to each other; forming one initial characteristic object or two or more initial characteristic objects in the glass plate by irradiating the glass plate with a laser from a side of the first surface of the glass plate, the initial characteristic object having a size of a diameter ϕ1 on the first surface; and performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter ϕf on the first surface is formed, and a thickness of the glass plate is adjusted from θ1 to a target value of θf.