Remedial treatment of wells with voids behind casing

A variety of systems, methods and compositions are disclosed, including, in one method, a method may comprise pumping a solids containing fluid through a wellbore and into a previously fractured subterranean formation at an injection rate and pressure that is at or above a fracture gradient of the p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Nguyen, Philip D
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A variety of systems, methods and compositions are disclosed, including, in one method, a method may comprise pumping a solids containing fluid through a wellbore and into a previously fractured subterranean formation at an injection rate and pressure that is at or above a fracture gradient of the previously fractured subterranean formation, wherein the solids containing fluid comprises a curable resin coated proppant; lowering the injection rate of the solids containing fluid to allow a portion of the curable resin coated proppant to, at least partially, pack and fill one or more voids surrounding a casing disposed in the wellbore; and allowing the portion of the curable resin coated proppant disposed in the one or more voids to cure and form an in situ mechanical screen.