Wiring structure of glass substrate, glass substrate and display device

The disclosure provides a wiring structure of a glass substrate used between a demultiplexer MUX and an integrated circuit IC. The siring structure includes a plurality of connecting lines, two ends of each connecting line are connected to the MUX and the IC, and a predetermined spacing is reserved...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Wu, Huanda
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The disclosure provides a wiring structure of a glass substrate used between a demultiplexer MUX and an integrated circuit IC. The siring structure includes a plurality of connecting lines, two ends of each connecting line are connected to the MUX and the IC, and a predetermined spacing is reserved between any two adjacent connecting lines. Wherein one or more conductive convex teeth are provided on at least one connecting line, and a predetermined distance is reserved between each convex tooth on any one of the connecting lines and an adjacent connecting line thereof or each convex tooth on the adjacent connecting line. The disclosure also provides a glass substrate and a display device. Performing the disclosure may reduce the resistance of the wiring in the present limited wiring space and improve the charging effect of the glass substrate.