Cooling systems for cooling electronic components

A first fluid is heated in a preheating section and passes into an evaporator coupled to a first electronic component. Operational heat from the first electronic component vaporizes the first fluid. A second fluid passes into a cold plate coupled to a second electronic component. Operational heat fr...

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Bibliographische Detailangaben
Hauptverfasser:	Chainer, Timothy J, Parida, Pritish R
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS WEAPONS
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Beschreibung
Zusammenfassung:	A first fluid is heated in a preheating section and passes into an evaporator coupled to a first electronic component. Operational heat from the first electronic component vaporizes the first fluid. A second fluid passes into a cold plate coupled to a second electronic component. Operational heat from the second electronic component heats the second fluid. First and second portions of the second fluid output from the cold plate pass through first and second routes, respectively. The first portion becomes thermally coupled to the preheating section and the second portion bypasses the preheating section. Heat transfer from the first portion to the preheating section causes the heating of the first fluid in the preheating section.