Methods related to implementing surface mount devices with ground paths

Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a method for fabricating a radio-frequency module includes providing a packaging substrate, the packaging substrate configu...

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Bibliographische Detailangaben
1. Verfasser:	Chen, Howard E
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS RESONATORS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSMISSION TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a method for fabricating a radio-frequency module includes providing a packaging substrate, the packaging substrate configured to receive a plurality of components and the packaging substrate including a ground plane. In some embodiments, the method includes mounting a surface mount device on the packaging substrate, and forming or providing a conductive layer over the surface mount device such that the surface mount device electrically connects the conductive layer with the ground plane to thereby provide radio-frequency shielding between first and second regions about the surface mount device.