Lithography apparatus, a method of manufacturing a device and a control program

An immersion lithography apparatus has a controller configured to control a substrate table to move along an exposure route including in order: an entry motion in which the substrate moves from an off-substrate position at which the immersion space does not overlap the substrate to an on-substrate p...

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Bibliographische Detailangaben
Hauptverfasser:	Wouters, Marijn, Eummelen, Erik Henricus Egidius Catharina, Kox, Ronald Frank, Blanco Carballo, Victor Manuel, Vieyra Salas, Jorge Alberto, Scholten, Bert Dirk, Custers, Rolf Hendrikus Jacobus, De Groot, Casper Roderik, Phillips, David Merritt, Van der Zanden, Frederik Antonius, Van de Vijver, Yuri Johannes Gabriël, Van den Nieuwelaar, Norbertus Josephus Martinus, Gunter, Pieter Lein Joseph
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CALCULATING CINEMATOGRAPHY COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	An immersion lithography apparatus has a controller configured to control a substrate table to move along an exposure route including in order: an entry motion in which the substrate moves from an off-substrate position at which the immersion space does not overlap the substrate to an on-substrate position at which the immersion space at least partially overlaps the substrate, a transfer motion in which the substrate table changes speed and/or direction and moves for at least a transfer time after the substrate moves to the on-substrate position, and an expose motion in which the substrate is scanned and the patterned beam is projected onto the substrate, wherein throughout the transfer motion at least a part of the immersion space overlaps the substrate and wherein the patterned beam is not projected onto the substrate during the entry motion and the transfer motion.