Lighting system incorporating chip scale package light emitting diodes

A lighting system includes a chip scale package light emitting diode mounted to a substrate and covered by an optic. The chip scale package light emitting diode has six faces with the top face and the four side faces operative to emit light and the bottom face oriented toward the substrate. The opti...

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Bibliographische Detailangaben
1. Verfasser:	Wegner, Scott David
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	A lighting system includes a chip scale package light emitting diode mounted to a substrate and covered by an optic. The chip scale package light emitting diode has six faces with the top face and the four side faces operative to emit light and the bottom face oriented toward the substrate. The optic includes a lower face with a cavity in which the chip scale package light emitting diode is at least partially disposed.