Reversing machine and substrate polishing apparatus

Disclosed is a reversing machine that reverses a substrate upside down. The reversing machine includes: a first arm pair configured to mount a substrate thereon; a second arm pair facing the first arm pair; an opening/closing mechanism configured to open/close the second arm pair so as to grip the s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Hoshina, Manao, Yazawa, Akihiro, Akazawa, Kenichi, Kobayashi, Kenichi
Format:	Patent
Sprache:	eng
Schlagworte:	CLEANING CLEANING IN GENERAL DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING PREVENTION OF FOULING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed is a reversing machine that reverses a substrate upside down. The reversing machine includes: a first arm pair configured to mount a substrate thereon; a second arm pair facing the first arm pair; an opening/closing mechanism configured to open/close the second arm pair so as to grip the substrate mounted on the first arm pair; and a rotating mechanism configured to rotate the first arm pair and the second arm pair around a predetermined axis that is set inside the first arm pair and the second arm pair and extends along an extension direction of the first arm pair and the second arm pair such that the substrate is reversed upside down.