Capacitive-based transducer with high aspect ratio

Techniques are presented for fabricating transducers and other types of microstructures having high aspect ratios. To achieve high aspect ratios, wafers are etched from both sides for example using deep reactive ion etching. The three-dimensional structure is designed to have an overall footprint le...

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Bibliographische Detailangaben
Hauptverfasser:	Tang, Yemin, Najafi, Khalil
Format:	Patent
Sprache:	eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS PUBLIC ADDRESS SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	Techniques are presented for fabricating transducers and other types of microstructures having high aspect ratios. To achieve high aspect ratios, wafers are etched from both sides for example using deep reactive ion etching. The three-dimensional structure is designed to have an overall footprint less than four hundred micrometers with a thickness on the order of 0.5-2 millimeters as compared to conventional planar devices.