Fan-out wafer level light-emitting diode package method and structure thereof

A fan-out wafer level light-emitting diode package method for packaging a plurality of light-emitting diode chips on a wafer protective film, the method comprising: forming a package surface layer on first electrodes of the light-emitting diode chips, and then forming a plurality of leading electrod...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Huang, Kuo-Hsin, Chao, Yung-Hsiang, Chou, Chung-Yu, Tsai, Tzeng-Guang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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