Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates

Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates

Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Cheng, Ming-Da, Lin, Wei-Hung, Chen, Meng-Tse, Huang, Kuei-Wei, Lin, Chih-Wei, Liu, Ching-Shi, Lin, Chun-Cheng
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.