Method and system for cleaning wafer and scrubber

A method of cleaning a wafer in semiconductor fabrication is provided. The method includes cleaning a wafer using a wafer scrubber. The method further includes moving the wafer scrubber into an agitated cleaning fluid. The method also includes creating a contact between the wafer scrubber and a clea...

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Bibliographische Detailangaben
Hauptverfasser: Hsieh, Ju-Ru, Chuang, Shun-Yu, Hu, Chien-Chun, Chang, Chen-Liang, Lin, Wei-Tuzo, Chen, Po-Chia
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of cleaning a wafer in semiconductor fabrication is provided. The method includes cleaning a wafer using a wafer scrubber. The method further includes moving the wafer scrubber into an agitated cleaning fluid. The method also includes creating a contact between the wafer scrubber and a cleaning stage in the agitated cleaning fluid. In addition, the method includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning fluid.