High density Tec-Cell carrier

The invention disclosed relates generally to handling substrates and wafers. In an example embodiment, to an improved wafer and substrate carrier or carrier system, method or apparatus. More specifically, to a carrier with improved abilities which may provide high density carriers, improved efficien...

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Bibliographische Detailangaben
Hauptverfasser:	Wohanka, Christian, Fenner, Yves, Fiddes, John, Dovids, Gerhard, Rahrbach, Bernd
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHAMBERS PROVIDED WITH MANIPULATION DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS MANIPULATORS PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention disclosed relates generally to handling substrates and wafers. In an example embodiment, to an improved wafer and substrate carrier or carrier system, method or apparatus. More specifically, to a carrier with improved abilities which may provide high density carriers, improved efficiency and other abilities such as increased cleanliness and reduced contamination to wafers during handling, storage or processing as well as higher density storage and better stocking, storage and handling abilities.